128 GB
HBM31700 MHz
Boost Clock600 W
TDP5 nm
ProcessShare on Social Media
Share Radeon Instinct MI300 specifications with othersTechnical Specifications
Core Specifications
Architecture:
CDNA 3.0
Process Size:
5 nm
Base Clock:
1000 MHz
Boost Clock:
1700 MHz
Shader Units:
14080
TMUs:
880
Memory & Performance
Memory Size:
128 GB
Memory Type:
HBM3
Memory Bandwidth:
6550.0 GB/s
Bus Interface:
PCIe 5.0 x16
TDP:
600 W
Suggested PSU:
1000 W
Cache & Die Information
L1 Cache:
16 KB
L2 Cache:
16.0 MB
Die Size:
1017 mm²
Transistors:
153.0 billion
Transistor Density:
150.4 million/mm²
Physical Specifications
Board Length:
267 mm
Board Width:
111 mm
Power Connectors:
2x 8-pin
Quick Facts
Performance
Texture Fill Rate
1496.0 GTexel/s
FP32 Performance
47.9 TFLOPS