288 GB
HBM3e2100 MHz
Boost Clock1000 W
TDP5 nm
ProcessShare on Social Media
Share Radeon Instinct MI325X specifications with othersTechnical Specifications
Core Specifications
Architecture:
CDNA 3.0
Process Size:
5 nm
Base Clock:
1000 MHz
Boost Clock:
2100 MHz
Shader Units:
19456
TMUs:
1216
Memory & Performance
Memory Size:
288 GB
Memory Type:
HBM3e
Memory Bandwidth:
10300.0 GB/s
Bus Interface:
PCIe 5.0 x16
TDP:
1000 W
Suggested PSU:
1400 W
Cache & Die Information
L1 Cache:
16 KB
L2 Cache:
16.0 MB
Die Size:
1017 mm²
Transistors:
153.0 billion
Transistor Density:
150.4 million/mm²
Physical Specifications
Power Connectors:
None
Quick Facts
Performance
Texture Fill Rate
2553.6 GTexel/s
FP32 Performance
81.7 TFLOPS