16 GB
HBM21746 MHz
Boost Clock300 W
TDP7 nm
ProcessShare on Social Media
Share Radeon Instinct MI50 specifications with othersTechnical Specifications
Core Specifications
Architecture:
GCN 5.1
Process Size:
7 nm
Base Clock:
1200 MHz
Boost Clock:
1746 MHz
Shader Units:
3840
TMUs:
240
ROPs:
64
Memory & Performance
Memory Size:
16 GB
Memory Type:
HBM2
Memory Bandwidth:
1020.0 GB/s
Bus Interface:
PCIe 4.0 x16
TDP:
300 W
Suggested PSU:
700 W
Cache & Die Information
L1 Cache:
16 KB
L2 Cache:
4.0 MB
Die Size:
331 mm²
Transistors:
13.2 billion
Transistor Density:
40.0 million/mm²
Physical Specifications
Board Length:
267 mm
Power Connectors:
2x 8-pin
Display Outputs:
1x mini-DisplayPort 1.4a
Quick Facts
Performance
Pixel Fill Rate
111.7 GPixel/s
Texture Fill Rate
419.0 GTexel/s
FP32 Performance
13.4 TFLOPS