256 MB
GDDR3800 MHz
Boost Clock32 W
TDP55 nm
ProcessShare on Social Media
Share FirePro V3700 specifications with othersTechnical Specifications
Core Specifications
Architecture:
TeraScale
Process Size:
55 nm
Base Clock:
800 MHz
Boost Clock:
800 MHz
Shader Units:
40
TMUs:
4
ROPs:
4
Memory & Performance
Memory Size:
256 MB
Memory Type:
GDDR3
Memory Bandwidth:
15.2 GB/s
Bus Interface:
PCIe 2.0 x16
TDP:
32 W
Suggested PSU:
200 W
Cache & Die Information
L2 Cache:
0.1 MB
Die Size:
67 mm²
Transistors:
0.2 billion
Transistor Density:
2.7 million/mm²
Physical Specifications
Board Length:
168 mm
Board Width:
111 mm
Power Connectors:
None
Display Outputs:
2x DVI
Quick Facts
Performance
Pixel Fill Rate
3.2 GPixel/s
Texture Fill Rate
3.2 GTexel/s
FP32 Performance
0.1 TFLOPS