1 GB
GDDR3800 MHz
Boost Clock76 W
TDP55 nm
ProcessShare on Social Media
Share FirePro V7750 specifications with othersTechnical Specifications
Core Specifications
Architecture:
TeraScale
Process Size:
55 nm
Base Clock:
800 MHz
Boost Clock:
800 MHz
Shader Units:
320
TMUs:
32
ROPs:
8
Memory & Performance
Memory Size:
1 GB
Memory Type:
GDDR3
Memory Bandwidth:
28.8 GB/s
Bus Interface:
PCIe 2.0 x16
TDP:
76 W
Suggested PSU:
250 W
Cache & Die Information
L1 Cache:
16 KB
L2 Cache:
0.1 MB
Die Size:
146 mm²
Transistors:
0.5 billion
Transistor Density:
3.5 million/mm²
Physical Specifications
Board Length:
234 mm
Board Width:
111 mm
Power Connectors:
1x 6-pin
Display Outputs:
1x DVI, 2x DisplayPort 1.0
Quick Facts
Performance
Pixel Fill Rate
6.4 GPixel/s
Texture Fill Rate
25.6 GTexel/s
FP32 Performance
0.5 TFLOPS