256 MB
GDDR3550 MHz
Boost Clock48 W
TDP55 nm
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Share FirePro V3750 specifications with othersTechnical Specifications
Core Specifications
Architecture:
TeraScale
Process Size:
55 nm
Base Clock:
550 MHz
Boost Clock:
550 MHz
Shader Units:
320
TMUs:
32
ROPs:
8
Memory & Performance
Memory Size:
256 MB
Memory Type:
GDDR3
Memory Bandwidth:
22.4 GB/s
Bus Interface:
PCIe 2.0 x16
TDP:
48 W
Suggested PSU:
200 W
Cache & Die Information
L1 Cache:
16 KB
L2 Cache:
0.1 MB
Die Size:
146 mm²
Transistors:
0.5 billion
Transistor Density:
3.5 million/mm²
Physical Specifications
Board Length:
168 mm
Board Width:
111 mm
Power Connectors:
None
Display Outputs:
1x DVI, 2x DisplayPort 1.0
Quick Facts
Performance
Pixel Fill Rate
4.4 GPixel/s
Texture Fill Rate
17.6 GTexel/s
FP32 Performance
0.4 TFLOPS