512 MB
GDDR3700 MHz
Boost Clock56 W
TDP55 nm
ProcessShare on Social Media
Share FirePro V5700 specifications with othersTechnical Specifications
Core Specifications
Architecture:
TeraScale
Process Size:
55 nm
Base Clock:
700 MHz
Boost Clock:
700 MHz
Shader Units:
320
TMUs:
32
ROPs:
8
Memory & Performance
Memory Size:
512 MB
Memory Type:
GDDR3
Memory Bandwidth:
28.8 GB/s
Bus Interface:
PCIe 2.0 x16
TDP:
56 W
Suggested PSU:
250 W
Cache & Die Information
L1 Cache:
16 KB
L2 Cache:
0.1 MB
Die Size:
146 mm²
Transistors:
0.5 billion
Transistor Density:
3.5 million/mm²
Physical Specifications
Board Length:
168 mm
Board Width:
111 mm
Power Connectors:
None
Display Outputs:
1x DVI, 2x DisplayPort 1.0
Quick Facts
Performance
Pixel Fill Rate
5.6 GPixel/s
Texture Fill Rate
22.4 GTexel/s
FP32 Performance
0.4 TFLOPS